英文字典中文字典


英文字典中文字典51ZiDian.com



中文字典辞典   英文字典 a   b   c   d   e   f   g   h   i   j   k   l   m   n   o   p   q   r   s   t   u   v   w   x   y   z       







请输入英文单字，中文词皆可：


请选择你想看的字典辞典：
单词字典翻译
schmieren查看　schmieren　在百度字典中的解释百度英翻中〔查看〕
schmieren查看　schmieren　在Google字典中的解释Google英翻中〔查看〕
schmieren查看　schmieren　在Yahoo字典中的解释Yahoo英翻中〔查看〕

安装中文字典英文字典查询工具!


中文字典英文字典工具:
选择颜色:
输入中英文单字

































































英文字典中文字典相关资料:


  • Bonding Lab Process of gold bonding wire, vol. 1｜TANAKA
    We would like to explain process of manufacturing bonding wire in the “Process of manufacturing of gold bonding wire Volume 1” through material processing starting with a unit of bonding wire which is used in production
  • 半导体“金线键合（Gold Wire Bonding）”工艺技术的详解； - 知乎
    线键合，在半导体封装工序又叫“焊线”，英文全称： Wire Bonding，简称：WB，是指在对芯片和基板间的胶粘剂处理以使其有更好的粘结性能后,用高纯金、铜或铝线把芯片的接口和基板的接口键合，主要就是用于半导体封装工艺中的芯片键合。 而本期要跟大家分享的就是关于“金线键合”的相关知识。 半导体键合金线 金丝，Gold Bonding Wire，其中金线 金丝的成分为： 金（纯度为99 999%），掺杂银、钯、镁、铁、铜、硅等元素。 同时也会掺杂不同的元素可以改变金线的硬度、刚性、延展度、电导率等参数。 1、目的： 建立基本的 wire bonding 标准，制定生产过程中产品合格／不合格的判断标准。 2、范围： 本标准只适用于金线球焊工艺。
  • Gold Use in Electronics - Bonding Wire
    Wire Bonding Process - Basic Property Needs for Bonding Wire - 1 Low Electric Resistance 2 Making Ball on Wire Tip by discharge from Bonding Machine Electrode 3 Flexibility ; corresponding to complicated Bonding Machine Movement Why Gold Use in Semiconductor manufacturing? Why High Purity Gold?
  • The Challenges of TANAKA Precious Metals-(3)The strongest . . .
    Gold bonding wire, which is known as the strongest bonding wire in the world, can be used for various forms of packages ranging from DIP to SIP, QFP, BGA, and FBGA They are robust in stacked packages and ultra-thin packages
  • Bonding Wires - TANAKA Precious Metals
    TANAKA offers bonding wires and ribbons, such as gold (Au), silver (Ag), copper (Cu), and aluminum (Al) ultra-fine wires (10 to 38µm) as metal bonding materials and thick wires (100 to 500um) for power devices
  • Industrial Products | Our Business | TANAKA
    Bonding wire is used to connect the silicon chip semiconductors and external electrodes found in smartphones, PCs and other devices One of the world’s largest suppliers of bonding wire, we are supporting the ever-evolving world of semiconductors
  • Some thoughts on bondability and strength of gold wire bonding
    An explanation for the plateau in the value of shear force obtained with increasing contact area is critical to relate the bonding parameters, the thickness of the bond pad and also the size of the wire bond to the intermetallic coverage required for the highest bonding strength





中文字典-英文字典  2005-2009